Based on Various Types of Wafer Materials, like Sapphire Substrate, SiC Substrate, GaAs Substrate, Silicon Substrate, Different Diamond Grinding stones would be Chosen, such as Diamond Vitrified Grinding stones, Metal Grinding stones, Resin Grinding stones.

In the Process of Machining, “HeroHome” Diamond Grinding stones are with Long Life, Advantageous Grinding and Thinning Result, Great Extent to Meet the Industry Machining Accuracy and Surface Finish Requirements for Optical Industry and Solve the Weakness of Machining Scratches on the Wafer Surface.

 

Regular Size of Grinding stones of Sapphire Grinding& Thinning;