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Add:Modern industrial zone, LinTong district, Xi’An, China.

Back Grinding Wheel for Sapphire Thinning

: Diamond Grinding Wheel

In the Process of Machining, “HeroHome” Diamond Grinding Wheels are with Long Life, Advantageous Grinding and Thinning Result, Great Extent to Meet the Industry Machining Accuracy and Surface Finish Requirements for Optical Industry and Solve the Weakness of Machining Scratches on the Wafer Surface.

: +86-29-63354776/63354775

: export.herohome@gmail.com

Part 1: General Information;

In Front of the Original Semiconductor Processing, Grinding, Thinning and Polishing of the Wafer Substrate, a Wide Variety of Diamond Grinding Wheel would be Used for Back Grinding & Processing the Grinding Wheel.

Based on Various Types of Wafer Materials, like Sapphire Substrate, SiC Substrate, GaAs Substrate, Silicon Substrate, Different Diamond Grinding Wheels would be Chosen, such as Diamond Vitrified Grinding Wheels, Metal Grinding Wheels, Resin Grinding Wheels.

Part 2: Regular Size of Grinding Wheels of Sapphire Grinding & Thinning;

Item	Size(MM)	Abrasive	Grain Size	Bond	Usage
Back Grinding Wheel for Thinning Sapphire	D150M12T28W15X6	Diamond	240#/280# Or as the requirement of customer	Resin Metal Vitrified	For thinning the Sapphire, Silicon, GaAs Substrate
	D202H30T20 with Groove
	D209H158T23.3
	D250/252H28T46
	D255H92T45
	D265H28T43.6
	D302H110T35
	D358H120T68
The Grinding Wheels could be also be produced as customers’ requirement.